Gigabyte B550 AORUS MASTER

AMD B550 AORUS Motherboard with Direct 16 Phases Digital VRM, Fins-Array Heatsink, Direct-Touch Heatpipe, Thermal Backplate, Triple PCIe 4.0 x4 M.2 Direct from CPU, Intel® WiFi 6 802.11ax, 2.5GbE LAN, RGB FUSION 2.0, Q-Flash Plus
- Supports AMD Ryzen™ 5000 Series / 3rd Gen Ryzen™ and 3rd Gen Ryzen™ with Radeon™ Graphics Processors
- Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
- Direct 16 Phases Digital VRM Solution with 70A Power Stage
- Advanced Thermal Design with Fins-Array Heatsink, Direct Touch Heatpipe and Thermal Baseplate
- Ultra Durable™ PCIe 4.0 Ready x16 Slot
- Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Thermal Guards
- Onboard Intel® WiFi 6 802.11ax 2T2R & BT5 with AORUS Antenna
- AMP-UP Audio with ALC1220-VB and WIMA Capacitors for Rear 120dB SNR
- Blazing Fast 2.5GbE LAN with Bandwidth Management
- USB 3.2 Gen2 Type-C™ & HDMI Support
- RGB FUSION 2.0 Supports Addressable LED & RGB LED Strips
- Smart Fan 5 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP and Noise Detection
- Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
- Pre-installed IO Shield for Easy and Quick Installation

DESIGN CONCEPT
DOMINANT IN DARKNESS



AMD StoreMI Technology
GIGABYTE B550 motherboards maximize your PC's potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.
The benefits of AMD StoreMI:
• Making the PC experience fast, smooth and easy
• Optimizing computer responsiveness from system boot to application launch
• Offering SSD performance with HDD capacity at an affordable cost
• Quickly accessing key files by automatically learning users' computing behaviors

ULTIMATE POWER DESIGN
To fully support the latest 3rd Gen AMD Ryzen™ processors, B550 motherboards equip with the ultimate power solution which is true direct, digital and multiple phases. After countless experiments and testing, GIGABYTE presents the unbeatable B550 motherboards for enthusiast. No Compromise and never stop to achieve higher.

UNPARALLELED PERFORMANCE
GIGABYTE realize that customer won't stop chasing a better computing performance. We take care of it and implement on products. Protective and optimized memory trace enhance the performance. Faster read and write are needed to save time and improve efficiency. We offer plenty of M.2 storage with thermal guards to ensure unthrottled read and write. In advance, adopting PCIe 4.0 ready components get the B550 motherboards easier to upgrade.
ADVANCED THERMAL SOLUTION
Unthrottled performance is guaranteed by the advanced thermal solution which including Fins-Array Heatsink, Direct Touch Heatpipe, Thermal Guards, and Thermal Baseplate. B550 motherboards are cool on MOSFETs and M.2 SSDs even on full loading. It provides lower temperatures for enthusiasts, overclockers and professional gamers.

NEXT GENERATION CONNECTIVITY
A high-end product needs to be future-proof so your system stays up-to-date with the latest technology. B550 motherboards provide all next generation network, storage, and WIFI connectivity to keep you up to speed
2.5GbE LAN Onboard
2X Faster than ever
Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least two times faster transfer speeds compared to general 1GbE networking. It’s perfectly suit for gamers and streamer with ultimate and smooth online experience. It also backward compatible with Multi-Gig(10/100/1000/2500Mbps) RJ-45 ethernet.


HI-FI AUDIO SYSTEM
For enthusiasts, sound quality is just as essential to the gaming experience. B550 motherboards are equipped with high quality audio components such as Hi-Fi grade WIMA FKP2 capacitors and Nichicon Fine Gold capacitors to provide a superb audio experience. The exclusive AORUS AMP-UP Audio technology makes for the ideal onboard sound solution for the most demanding audiophiles.
New Introduce Intel® WiFi 6 802.11ax + BT 5 Module
Intel Wireless solution supports 802.11ax, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.
Benefit of WiFi 6:
- 5.5X throughput than 802.11ac 1x1*
- 4X better network capacity, no traffic jams especially in those dense area with lots of devices
- Network efficiency increase for better user experience


Brand - Gigabyte, Model - Gigabyte B550 AORUS MASTER, Chipset Brand - AMD, Chipset - AMD B550, CPU Sockets - AM4, Supported CPU - AMD Ryzen 5000 Series/ 3rd Generation AMD Ryzen processors / 3rd Gen AMD Ryzen with Radeon Graphics processors, Memory Type - DDR4, Memory MHz - AMD Ryzen 5000 (5100(O.C.) / 5000(O.C.) / 4866(O.C.) / 4600(O.C.) / 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) /3200/2933/2667/2400/2133MHz), 3rd Gen (5400(O.C.) / 5200(O.C.) / 5000(O.C.) / 4866(O.C.) / 4600(O.C.) / 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) /3200/2933/2667/2400/2133MHz), Memory Channel - Dual Channel, Memory Slot - 4, Memory Max. - 128GB, Optane Memory Support - No, Graphics - AMD Ryzen with Radeon Graphics, Multi-GPU Support - No, PCI Express Slot - 1 x PCI Express x16 slot (PCIEX16), 2 x PCI Express x16 slots (PCIEX4_1/PCIEX4_2), Storage Interface - 6Gb/s, M.2 Slot - 3 x M.2 (1 x M.2 M key type 2242/2280/22110, (SATA and PCIe 4.0 x4/x2 / SATA and PCIe 3.0 x4/x2), 2 x M.2 M key type 2242/2280/22110, (PCIe 4.0 x4/x2 / PCIe 3.0 x4/x2)), LAN Chipset - Realtek 2.5GbE, LAN Speed (Mbps) - 2.5 Gbit/1000Mbps /100Mbps, Audio Chipset - Realtek ALC1220-VB, Audio Channel - 2/4/5.1/7.1, Wi-Fi - Yes, Wi-Fi Technology - Intel Wi-Fi 6 AX200, WIFI a/b/g/n/ac with wave 2 features, ax, supporting 2.4/5 GHz Dual-Band, Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate, Bluetooth - Bluetooth 5, USB Port - 6 x USB 3.2 Gen 1, 8 x USB 2.0, 1 x USB 3.2 Gen 2 Type-C, VGA Port - No, DVI Port - No, HDMI Port - 1, DisplayPort (DP) - No, IDE Port - No, SATA Port - 6 x SATA, BIOS Type - 2 x 256 Mbit flash, BIOS Model - AMI UEFI BIOS, BIOS Version - PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0, FireWire - No, CrossFire Support - No, Sli Support - No, RaidSupport - 0, 1, 10, Thunderbolt - 1 x Thunderbolt, TPM Port - Yes, COM Port - No, RGB Support - Yes, RGB Sync - RGB FUSION 2.0, RGB Connector - 2 x RGB LED strip headers, Form Factor - ATX, Supported Operating System - Windows 10, Special Features - AMD B550 AORUS Motherboard with Direct 16 Phases Digital VRM, Fins-Array Heatsink, Direct-Touch Heatpipe, Thermal Backplate, Triple PCIe 4.0 x4 M.2 Direct from CPU, Intel WiFi 6 802.11ax, 2.5GbE LAN, RGB FUSION 2.0, Q-Flash Plus, Supports 3rd Gen AMD Ryzen Processors, Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs, Direct 16 Phases Digital VRM Solution with 70A Power Stage, Advanced Thermal Design with Fins-Array Heatsink, Direct Touch Heatpipe and Thermal Baseplate, Ultra Durable PCIe 4.0 Ready x16 Slot, Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Thermal Guards, Onboard Intel WiFi 6 802.11ax 2T2R & BT5 with AORUS Antenna, AMP-UP Audio with ALC1220-VB and WIMA Capacitors for Rear 120dB SNR, Blazing Fast 2.5GbE LAN with Bandwidth Management, USB 3.2 Gen2 Type-C & HDMI Support, RGB FUSION 2.0 Supports Addressable LED & RGB LED Strips, Smart Fan 5 Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP and Noise Detection, Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card, Pre-installed IO Shield for Easy and Quick Installation, Others - Intel Wi-Fi 6 AX200, WIFI a/ b/g/n/ac/ax, supporting 2.4/5 GHz Dual-Band, Bluetooth version: 5.0, 5 x audio jacks, 1 x RJ-45 port, Support for DualBIOS, 1 x Q-Flash Plus button, 1 x optical S/PDIF Out connector, 1 x noise detection header, 1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only), 1 x Clear CMOS jumper, 2 x temperature sensor headers, 1 x 24-pin ATX main power connector, 1 x 8-pin ATX 12V power connector, 1 x 4-pin ATX 12V power connector, 1 x CPU fan header, 1 x water cooling CPU fan header, 4 x system fan headers, 2 x system fan/water cooling pump headers, 2 x addressable LED strip headers, 2 x RGB LED strip headers, 1 x CPU cooler LED strip/RGB LED strip header, Warranty - 3 Year, Country of Origin - Taiwan, Made in/ Assemble - China